The global Advanced Packaging Market was valued at USD 30.90 billion in 2023 and is expected to grow to USD 33.00 billion in 2024, reaching USD 54.73 billion by 2031. This represents a compound annual growth rate (CAGR) of 7.49% during the forecast period. This growth is driven by the rising demand for miniaturized, high-performance electronic devices across various industries like consumer electronics, automotive, and telecommunications.
The Advanced Packaging Market is poised for significant growth, driven by technological advancements, increased demand for semiconductors, and the rising application of advanced packaging in industries such as consumer electronics, automotive, aerospace, and healthcare.
Growth Factors
The growing demand for smaller, more powerful electronic devices is significantly boosting the need for advanced packaging solutions. This trend is particularly critical in industries like consumer electronics, automotive, and telecommunications, where there is a continuous requirement for compact, high-performance components that deliver improved functionality and efficiency.
Advanced packaging technologies like 3D integrated circuits (ICs) and system-in-package (SiP) enable the integration of multiple functions within a smaller form factor. These solutions align with the industry's push for miniaturization, improving device performance and efficiency while fueling market expansion. By consolidating various components into compact designs, these technologies meet growing demands for high-performance, space-saving electronics across sectors.
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Key Companies in Advanced Packaging Market
- Amkor Technology
- Taiwan Semiconductor Manufacturing Company Limited
- ASE TECHNOLOGY HOLDING
- Intel Corporation
- JCET Group Co. Ltd
- Chipbond Technology Corporation
- Samsung
- Universal Instruments Corporation
- ChipMOS Technologies Inc.
- Brewer Science, Inc.
The global advanced packaging market is segmented:
By End-Use Industry
- Consumer Electronics
- Automotive
- Healthcare
- Telecommunications
- Industrial
- Others
By Packaging Platform
- Flip-chip
- Fan-out
- Fan-in WLP
- 3D Stacking
- Embedded Die
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- France
- UK
- Spain
- Germany
- Italy
- Russia
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
- Middle East & Africa
- GCC
- North Africa
- South Africa
- Rest of Middle East & Africa
- Latin America
- Brazil
- Argentina
- Rest of Latin AmericaTop of FormBottom of Form
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